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                                                                        Capability
Layer1-24LMin.   finished thickness(2L)0.3mm
Max. panel size635×1120mmMin.   finished thickness(multilayer)0.4mm
Max. Cu thickness5OZMax.   finished thickness4.0mm
Min.Cu thickness(base)1/3OZMin.   core thickness0.1mm
Max.Cu thickness(base)5OZDrilling   hole to hole tolerance±0.05mm
Aspect ratio10:1Min.   hole diameter tolerance (PTH)±0.075mm
Etching tolerance±10%Min.   hole diameter tolerance (NPTH)±0.05mm
Min.line with0.075mm(3mil)Min.   routing tolerance±0.10mm
Min.line space0.075mm(3mil)Min.   stamping edge to edge tolerance±0.075mm
Min. hole diameter0.20mmV-cut   edge to edge tolerance±0.10mm(4mil)
Board bow and twist≤   0.75%Registration(O/L)±0.05mm(2mil)
Impedance tolerance±10%Paterning   positioning tolerance±0.075mm(3mil)
Hole copper thickness30umMax.test   points/Board(universal ET)Jig Test Fixture:15000
    Flying Probing:1-∞
Surface finishHAL-LF,HASL,Immersion Gold,Immersion Silever,OSP
Base materialFR-4,   Hi-TG FR-4, Halogern free FR-4、CEM1、CEM3, Aluminum based boards
Standard lead timeMultilayer:9   wds,2L:7wds,sample:3-6wds



Product information
Product name Product picture Product parameters
PTFE laminate - Multilayer
Traditional antenna PCB
應用領域:LED照明

板材:鋁基

層數:1L

板厚:0.8mm

完成銅厚1OZ

表面處理:OSP

應用領域:LED照明

板材:鋁基

層數:1L

板厚:1.2mm

完成銅厚1OZ

表面處理:OSP

應用領域:LED照明

板材:鋁基

層數:1L

板厚:1.5mm

完成銅厚1OZ

表面處理:OSP

Application field: automotive power supply

材質: FR4

層數: 8L

板厚: 2.0mm

銅厚: 4Oz

最小孔徑: 0.9mm

表面處理: 無鉛噴錫

特性: 厚銅



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