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      1. Species

        Your location:Home > Products > Species
                                                                                Capability
        Layer1-24LMin.   finished thickness(2L)0.3mm
        Max. panel size635×1120mmMin.   finished thickness(multilayer)0.4mm
        Max. Cu thickness5OZMax.   finished thickness4.0mm
        Min.Cu thickness(base)1/3OZMin.   core thickness0.1mm
        Max.Cu thickness(base)5OZDrilling   hole to hole tolerance±0.05mm
        Aspect ratio10:1Min.   hole diameter tolerance (PTH)±0.075mm
        Etching tolerance±10%Min.   hole diameter tolerance (NPTH)±0.05mm
        Min.line with0.075mm(3mil)Min.   routing tolerance±0.10mm
        Min.line space0.075mm(3mil)Min.   stamping edge to edge tolerance±0.075mm
        Min. hole diameter0.20mmV-cut   edge to edge tolerance±0.10mm(4mil)
        Board bow and twist≤   0.75%Registration(O/L)±0.05mm(2mil)
        Impedance tolerance±10%Paterning   positioning tolerance±0.075mm(3mil)
        Hole copper thickness30umMax.test   points/Board(universal ET)Jig Test Fixture:15000
            Flying Probing:1-∞
        Surface finishHAL-LF,HASL,Immersion Gold,Immersion Silever,OSP
        Base materialFR-4,   Hi-TG FR-4, Halogern free FR-4、CEM1、CEM3, Aluminum based boards
        Standard lead timeMultilayer:9   wds,2L:7wds,sample:3-6wds



        Product information
        Product name Product picture Product parameters
        PTFE laminate - Multilayer
        Traditional antenna PCB
        應用領域:LED照明

        板材:鋁基

        層數:1L

        板厚:0.8mm

        完成銅厚1OZ

        表面處理:OSP

        應用領域:LED照明

        板材:鋁基

        層數:1L

        板厚:1.2mm

        完成銅厚1OZ

        表面處理:OSP

        應用領域:LED照明

        板材:鋁基

        層數:1L

        板厚:1.5mm

        完成銅厚1OZ

        表面處理:OSP

        Application field: automotive power supply

        材質: FR4

        層數: 8L

        板厚: 2.0mm

        銅厚: 4Oz

        最小孔徑: 0.9mm

        表面處理: 無鉛噴錫

        特性: 厚銅



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